View HC-5509A1_423539.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

(R)
PRELIMINARY
May 1997
Features
S IGN DES NEW t FOR 60 ter a DED A1R30 ort Cen /tsc EN om upp 509 MM ECO ee HC5 nical S tersil.c S T ech .in OT R w N our L or w w I tact con INTERS or 81- 88
HC-5509A1
SLIC Subscriber Line Interface Circuit
Description
The HC-5509A1 telephone Subscriber Line Interface Circuit integrates most of the BORSCHT functions on a monolithic IC. The device is manufactured in a Dielectric Isolation (DI) process and is designed for use as a high voltage interface between the traditional telephone subscriber pair (Tip and Ring) and the low voltage filtering and coding/decoding functions of the line card. Together with a secondary protection diode bridge and "feed" resistors, the device will withstand 1000V lightning induced surges, in plastic packages. The SLIC also maintains specified transmission performance in the presence of externally induced longitudinal currents. The BORSCHT functions that the SLIC provides are: * Battery Feed with Subscriber Loop Current Limiting * Overvoltage Protection * Ring Relay Driver * Supervisory Signaling Functions * Hybrid Functions (with External Op-Amp) * Test (or Battery Reversal) Relay Driver
* DI Monolithic High Voltage Process * Compatible with Worldwide PBX and CO Performance Requirements * Controlled Supply of Battery Feed Current with Programmable Current Limit * Operates with 5V Positive Supply (VB+) * Internal Ring Relay Driver and a Utility Relay Driver * High Impedance Mode for Subscriber Loop * High Temperature Alarm Output * Low Power Consumption During Standby Functions * Switch Hook, Ground Key, and Ring Trip Detection * Selective Power Denial to Subscriber * Voice Path Active During Power Denial * On Chip Op-Amp for 2 Wire Impedance Matching
Applications
* Solid State Line Interface Circuit for PBX or Central Office Systems, Digital Loop Carrier Systems * Hotel/Motel Switching Systems * Direct Inward Dialing (DID) Trunks * Voice Messaging PBX's * High Voltage 2W/4W, 4W/2W Hybrid
Ordering Information
PART NUMBER HC1-5509A1-5 HC1-5509A1-9 HC3-5509A1-5 HC3-5509A1-9 HC4P5509A1-5 HC4P5509A1-9 HC9P5509A1-5 TEMP. RANGE 0o to +75oC -40o to +85oC 0o to +75oC -40o to +85oC 0 to
o
PACKAGE 28 Lead Ceramic DIP 28 Lead Ceramic DIP 28 Lead Plastic DIP 28 Lead Plastic DIP 44 Lead PLCC 44 Lead PLCC 28 Lead SOIC
In addition, the SLIC provides selective denial of power to subscriber loops, a programmable subscriber loop current limit from 20 to 60mA, a thermal shutdown with an alarm output and line fault protection. Switch hook detection, ring trip detection and ground key detection functions are also incorporated in the SLIC device. The HC-5509A1 SLIC is ideally suited for line card designs in PBX and CO systems, replacing traditional transformer solutions.
+75oC
-40o to +85oC 0o to +75oC
Pinouts
HC-5509A1 (PDIP, CDIP, SOIC) TOP VIEW
N/C AG VB+ C1 F1 F0 RS SHD GKD TST 1 2 3 4 5 6 7 8 9 28 C2 27 VB26 RF 25 TF 24 VFB 23 RD 22 BG 21 PR 20 PRI 19 VTX 18 LAO 17 VRX 16 RFS 15 RING
HC-5509A1 (PLCC) TOP VIEW
C1 VB+ RF2 RF1
TRUTH TABLE F1 0 0 1 1 1 F0 0 1 0 0 1 ACTION Normal Loop Feed RD Active Power Down Latch RESET Power on RESET Loop Power Denial Active
N/C F1 F0 RS SHD GKD TST ALM N/C N/C N/C 7 8 9 10 11 12 13 14 15 16 17
65
4
32
1 44 43 42 41 40 X 39 38 37 36 35 34 33 32 31 30 29 TF2 VFB RD BG DG PR PRI VTX LAO N/C N/C
ALM 10 ILMT 11 OUT 1 12 -IN 1 13 TIP 14
18 19 20 21 22 23 24 25 26 27 28 OUT 1 -IN 1 N/C TIP N/C RFS N/C RING ILMT VRX N/C
TF1
N/C
N/C
C2 VB-
AG
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2002. All Rights Reserved 8-131
File Number
3567.1
,
Specifications HC-5509A1
Absolute Maximum Ratings (Note 1)
Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +15V Maximum Supply Voltages (V B+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V (V B+)-(VB-). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +75V Junction Temperature Ceramic . . . . . . . . . . . . . . . . . . . . . . +175oC Junction Temperature Plastic . . . . . . . . . . . . . . . . . . . . . . . . +150oC Lead Temperature (Soldering 10 Sec.) . . . . . . . . . . . . . . . . +300oC
Operating Conditions
Operating Temperature Range HC-5509A1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to +75oC HC-5509A1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to +85oC Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC Relay Drivers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to +12V Positive Power Supply (VB+) . . . . . . . . . . . . . . . . . . . . . . . . +5V 5% Negative Power Supply (V B-) . . . . . . . . . . . . . . . . . . . . -42V to -58V Loop Resistance (R L) . . . . . . . . . . . . . . . . . 200 to 1750 (Note 2)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at TA = +25oC, Min-Max Parameters are over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = DG = BG = 0V. All A.C. Parameters are specified at 600 2-Wire terminating impedance. TEST CONDITIONS MIN TYP MAX UNITS
PARAMETER A.C. TRANSMISSION PARAMETERS RX Input Impedance TX Output Impedance 4W Input Overload Level
300Hz to 3.4kHz (Note 3) 300Hz to 3.4kHz (Note 3) 300Hz to 3.4kHz R L = 1200, 600 Reference Matched for 600 (Note 3)
+1.5
100 -
20 -
k VPEAK
2W Return Loss SRL LO ERL SRL HI 2W Longitudinal to Metallic Balance Off Hook 4W Longitudinal Balance Off Hook Low Frequency Longitudinal Balance
26 30 30 Per ANSI/IEEE STD 455-1976 (Note 3) 300Hz to 3400Hz 300Hz to 3400Hz (Note 3) 58
35 40 40 63
-
dB dB dB dB
50
55
-
dB
R.E.A. Test Circuit ILINE = 40mA TA = +25oC (Note 3)
-
-
-67 23 30
dBmp dBrnC mArms
Longitudinal Current Capability Insertion Loss 2W/4W 4W/2W 4W/4W Frequency Response
ILINE = 40mA TA =
+25oC
(Note 3)
0dBm at 1kHz, Referenced 600 300Hz to 3400Hz (Note 3) Referenced to Absolute Level at 1kHz, 0dBm Referenced 600 Referenced to -10dBm (Note 3) +3 to -40dBm -40 to -50dBm -50 to -55dBm 0.05 0.1 0.3 dB dB dB 0.05 0.05 0.02 0.2 0.2 0.12 0.05 dB dB dB dB
Level Linearity 2W to 4W and 4W to 2W
Absolute Delay
(Note 3)
8-132
Specifications HC-5509A1
Electrical Specifications Unless Otherwise Specified, Typical Parameters are at TA = +25oC, Min-Max Parameters are over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = DG = BG = 0V. All A.C. Parameters are specified at 600 2-Wire terminating impedance. (Continued) TEST CONDITIONS 300Hz to 3400Hz 300Hz to 3400Hz 300Hz to 3400Hz (Note 3) See Figure 1 Reference Level 0dBm at 600 300Hz to 3400Hz (Note 3) (Note 3) C-Message Psophometric 3kHz Flat Power Supply Rejection Ratio VB+ to 2W VB+ to 4W VB- to 2W VB- to 4W VB+ to 4W VB- to 2W VB- to 4W VB- to 4W Ring Sync Pulse Width D.C. PARAMETERS Loop Current Programming Limit Range Accuracy Loop Current During Power Denial Fault Currents TIP to Ground RING to Ground TIP and RING to Ground Switch Hook Detection Threshold Ground Key Detection Threshold Thermal ALARM Output Ring Trip Comparator Threshold Safe Operating Die Temperature Exceeded See Typical Applications for more information 8 140 9.5 30 60 90 12 12 13.5 15 16 160 17.5 mA mA mA mA mA
o
PARAMETER 2W/4W 4W/2W 4W/4W Transhybrid Loss, THL Total Harmonic Distortion 2W/4W, 4W/2W, 4W/4W Idle Channel Noise 2W and 4W
MIN -
TYP 40 -
MAX 1 1 1.5 -52
UNITS s s s dB dB
-
-
5 -85 15
dBrnC dBmp dBrn
(Note 3) 30Hz to 200Hz, RL = 600
20 20 20 20
29 29 29 29 25 25 -
500
dB dB dB dB dB dB dB dB s
(Note 3) 200Hz to 16kHz, R L = 600
30 30 20 20 50
20 10 RL = 200 -
40 3
60 5
mA % mA
C
mA
Dial Pulse Distortion
-
0.1
0.5
ms
8-133
Specifications HC-5509A1
Electrical Specifications Unless Otherwise Specified, Typical Parameters are at TA = +25oC, Min-Max Parameters are over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = DG = BG = 0V. All A.C. Parameters are specified at 600 2-Wire terminating impedance. (Continued) TEST CONDITIONS MIN TYP MAX UNITS
PARAMETER Relay Driver Outputs On Voltage VOL Off Leakage Current TTL/CMOS Logic Inputs (F0, F1, RS, TEST, PRI) Logic `0' V IL Logic `1' V IH Input Current (F0, F1, RS, TEST, PRI) Logic Outputs Logic `0' V OL Logic `1' V OH Power Dissipation On Hook IB+ IBUNCOMMITED OP AMP PARAMETERS Input Offset Voltage Input Offset Current Differential Input Resistance Output Voltage Swing Small Signal GBW NOTES: (Note 2) RL = 10k (Note 2)
IOL (PR) = 60mA, IOL (RD) = 30mA VOH = 13.2V
-
0.2 10
0.5 100
V A
2.0 0V VIN 5V -
-
0.8 5.5 100
V V A
ILOAD = 800A ILOAD = 40A Relay Drivers Off VB+ = +5.25V, VB- = -58V, RLOOP = VB+ = +5.25V, VB- = -58V, RLOOP =
2.7 -
0.1 200 -
0.5 6 -
V V mW mA mA

-6
-
5 10 1 3 1
-
mV nA M VP-P MHz
1. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not necessarily implied. 2. May Be Extended to 1900 With Application Circuit. 3. These parameters are controlled by design or process parameters and are not directly tested. These parameters are characterized upon initial design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and specification compliance.
Pin Descriptions
DIP/SOIC 1 PLCC 2 SYMBOL AG DESCRIPTION Analog Ground - To be connected to zero potential. Serves as a reference for the transmit output and receive input terminals. Positive Voltage Source - Most Positive Supply. Capacitor #C1 - An external capacitor to be connected between this terminal and analog ground. Required for proper operation of the loop current limiting function. Function Address #1 - A TTL and CMOS compatible input used with F0 function address line to externally select logic functions. The three selectable functions are mutually exclusive. See Truth Table on page1. F1 should be toggled high after power is applied.
2 3
3 4
VB+ C1
4
8
F1
8-134
HC-5509A1 Pin Descriptions (Continued)
DIP/SOIC 5 PLCC 9 SYMBOL F0 DESCRIPTION Function Address #0 - A TTL and CMOS compatible input used with F1 function address line to externally select logic functions. The three selectable functions are mutually exclusive. See Truth Table on page 1. Ring Synchronization Input - A TTL - compatible clock input. The clock is arranged such that a positive pulse (50 - 500s) occurs on the zero crossing of the ring voltage source, as it appears at the RFS terminal. For Tip side injected systems, the RS pulse should occur on the negative going zero crossing and for Ring injected systems, on the positive going zero crossing. This ensures that the ring delay activates and deactivates when the instantaneous ring voltage is near zero. If synchronization is not required, the pin should be tied to +5. Switch Hook Detection - An active low LS TTL compatible logic output. A line supervisory output. Ground Key Detection - An active low LS TTL compatible logic output. A line supervisory output. A TTL logic input. A low on this pin will set a latch and keep the SLIC in a power down mode until the proper F1, F0 state is set and will keep ALM low. See Truth Table on page 1. A LS TTL compatible active low output which responds to the thermal detector circuit when a safe operating die temperature has been exceeded. When TST is forced low by an external control signal, ALM is latched low until the proper F1, F0 state and TST input is brought high. The ALM can be tied directly to the TST pin to power down the part when a thermal fault is detected and then reset with F0, F1. See Truth Table on page 1. It is possible to ignore transient thermal overload conditions in the SLIC by delaying the response to the TST pin from the ALM. Care must be exercised in attempting this as continued thermal overstress may reduced component life. Loop Current Limit - Voltage on this pin sets the short loop current limiting conditions using a resistive voltage divider. The analog output of the spare operational amplifier. The inverting analog input of the spare operational amplifier. An analog input connected to the TIP (more positive) side of the subscriber loop through a feed resistor and ring relay contact. Functions with the RING terminal to receive voice signals from the telephone and for loop monitoring purpose. An analog input connected to the RING (more negative) side of the subscriber loop through a feed resistor. Functions with the TIP terminal to receive voice signals from the telephone and for loop monitoring purposes. Ring Feed Sense - Senses RING side of the loop for Ground Key Detection. During Ring injected ringing the ring signal at this node is isolated from RF via the ring relay. For Tip injected ringing, the RF and RFS pins must be shorted. Receive Input, Four Wire Side - A high impedance analog input. AC signals appearing at this input drive the Tip Feed and Ring Feed amplifiers differentially. Longitudinal Amplifier Output - A low impedance output to be connected to C2 through a low pass filter. Output is proportional to the difference in ITIP and IRING. Transmit Output, Four Wire Side - A low impedance analog output which represents the differential voltage across TIP and RING. Transhybrid balancing must be performed beyond this output to completely implement two to four wire conversion. This output is referenced to analog ground. Since the D.C. level of this output varies with loop current, capacitive coupling to the next stage is necessary. A TTL compatible input used to control PR. PRI active High = PR active low. An active low open collector output. Can be used to drive a Polarity Reversal Relay. Digital Ground - To be connected to zero potential - serves as reference for all digital inputs and outputs on the SLIC. Battery Ground - Tube connected to zero potential. All loop current and some quiescent current flows into this terminal.
6
10
RS
7 8 9
11 12 13
SHD GKD TST
10
14
ALM
11
18
ILMT
12 13 14
19 20 22
OUT1 -IN1 TIP
15
24
RING
16
25
RFS
17
27
VRX
18
31
LAO
19
32
VTX
20 21 NA
33 34 35
PRI PR DG
22
36
BG
8-135
HC-5509A1 Pin Descriptions (Continued)
DIP/SOIC 23 PLCC 37 SYMBOL RD DESCRIPTION Ring Relay Driver - An active low open collector output. Used to drive a relay that switches ringing signals onto the 2-Wire line. Feedback input to the tip feed amplifier; may be used in conjunction with transmit output signal and the spare op-amp to accommodate 2W line impedance matching. Tip Feed - A low impedance analog output connected to the TIP terminal through a feed resistor. Functions with the RF terminal to provide loop current, and to feed voice signals to the telephone set and to sink longitudinal currents. Must be tied to TF1. Tie directly to TF2 in the PLCC application. Ring Feed - A low impedance analog output connected to the RING terminal through a feed resistor. Functions with the TF terminal to provide loop current, feed voice signals to the telephone set, and to sink longitudinal currents. Tie directly to RF2. Tie directly to RF1 in the PLCC application. The battery voltage source. The most negative supply. Capacitor #2 - An external capacitor to be connected between this terminal and ground. It prevents false ring trip detection from occurring when longitudinal currents are induced onto the subscriber loop from power lines and other noise sources. This capacitor should be nonpolarized. No internal connection.
24
38
VFB
25
39
TF2
NA 26
40 41
TF1 RF1
NA 27 28
42 43 44
RF2 VBC2
1, 5, 6, 7, 15, 16, 17, 21, 23, 26, 28, 29, 30 NOTE:
NC
1. All grounds (AG, BG, DG) must be applied before V B+ or VB-. Failure to do so may result in premature failure of the part. If a user wishes to run separate grounds off a line card, the AG must be applied first.
8-136
HC-5509A1 Functional Diagram
DIP OR SOIC
VRX R 2R R/2 RF1 2R 2R + 17 OUT 1 12 -IN 1 13 OP AMP VFB 24 VTX 19 VB
TA + 2R
SHD THERM LTD
25k RTD GKD LA + 25k FAULT DET
90k VB/2 REF 3 C1 18 LAO 28 C2 GM +
RF2
11 ILMT
High voltage surge conditions are as specified in Table 1.
Die Characteristics
Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 Diode Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 x 120 Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . Connected Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI Thermal Constants (oC/W) JA JC Ceramic DIP . . . . . . . . . . . . . . . . . . . . 48 12 Plastic DIP . . . . . . . . . . . . . . . . . . . . . . 51 21 PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . 47 17 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . 72 22
The SLIC will withstand longitudinal currents up to a maximum or 30mArms, 15mArms per leg, without any performance degradation
.
TABLE 1. TEST CONDITION 10s Rise/ 1000s Fall 10s Rise/ 1000s Fall PERFORMANCE (MAX) 1000 (Plastic) 500 (Ceramic) 1000 (Plastic) 500 (Ceramic) 1000 (Plastic) 500 (Ceramic)
PARAMETER Longitudinal Surge Metallic Surge
UNITS V PEAK V PEAK V PEAK V PEAK V PEAK V PEAK
Overvoltage Protection and Longitudinal Current Protection
The SLIC device, in conjunction with an external protection bridge, will withstand high voltage lightning surges and power line crosses.
T/GND R/GND 50/60Hz Current T/GND R/GND
10s Rise/ 1000s Fall
11 Cycles Limited to 10Arms
700 (Plastic) 350 (Ceramic)
V RMS V RMS
8-137
HC-5509A1 Functional Diagram (Continued)
PLCC
VRX R 2R R/2 RF1 2R 2R + 27 OUT 1 19 -IN 1 20 OP AMP VFB 38 VTX 32 VB
TA + 2R
SHD THERM LTD
25k RTD GKD LA + 25k FAULT DET
90k VB/2 REF 4 C1 31 LAO 44 C2 GM +
RF2
18 ILMT
8-138
HC-5509A1 Logic Diagram
RELAY DRIVER
THERMAL SHUT DOWN
RMAL T WN CH
INJ A B C KEY A B C
NOTE: PRI is an independent switch driven by TTL input lev-
8-139
HC-5509A1 Applications Diagram
+5V +5V K1 R S1 C S1 TIP K1A RB1 *SECONDARY PROTECTION C5 PRIMARY PROTECTION RB2 K2 SHD GKD PRI RS TEST F1 ALARM F0 RD PR TIP TF1** TF2** VBRF2** KIB R S2 C S2 V RING 150VPEAK(MAX) RB4 LAO RING VBBG C2 RF1** RFS SLIC HC-5509A1 CAC VTX KR F -IN1 KZ0 OUT1 TO HYBIRD BALANCE NETWORK ILIMIT VRX+ VFB RL1 FROM PCM FILTER/CODER RL2 SYSTEM CONTROLLER
R B3 RING PTC
***
DG AG VB+ C1
Z1
C3
CF2
C4 +5V RF2 RF1 CF1
FIGURE 1. TYPICAL LINE CIRCUIT APPLICATION WITH THE MONOLITHIC SLIC
TYPICAL COMPONENT VALUES C1 = 0.5F, 30V RF1 = RF2 = 210k, 1% CF1 = CF2 = 0.22F, 10%, 20V Nonpolarized C3 = 0.01F, 100V, 20% C4 = 0.01F, 100V, 20% C5 = 0.01F, 100V, 20% CAC = 0.5F, 20V KZ0 = 60k, (Z0 = 600, K = Scaling Factor = 100) RL1, RL2; Current Limit Setting Resistors: RL1 + RL2 > 90k offset ILIMIT = (0.6) (RL1 + RL2)/(200 x RL2), RL1 typically 100k
NOTES: 1. All grounds (AG, BG, & DG) must be applied before VB+ or VB-. Failure to do so may result in premature failure of the part. If a user wishes to run separate grounds off a line card, the AG must be applied first. 2. Application shows Ring Injected Ringing, a Balanced or Tip injected configuration may be used. Additional information is contained in Application Note 549, "The HC-550X Telephone SLICs" By Geoff Phillips
KRF = 20k, RF = 2(RB2 + RB4), K = Scaling Factor = 100) RB1 = RB2 = RB3 = RB4 = 50 (1% absolute, matching requirements covered in a Tech Brief) RS1 = RS2 = 1k typically CS1 = CS2 = 0.1F, 200V typically, depending on VRing and line length. Z1 = 150V to 200V transient protector. PTC used as ring generator ballast.
* Secondary protection diode bridge recommended is 3A, 200V type. **TF1, TF2 and RF1, RF2 are on PLCC only and should be connected together as shown. ***Not Present on DIP or SOIC packages.
8-140

▲Up To Search▲

Price & Availability of HC-5509A1

	To Download HC-5509A1 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .